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  • Momentum Seminar Archive - PDF files of slides, ADS project files, and other materials supporting a one-day customer seminar covering key topics in Momentum set-up and simulation.

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2002 and earlier

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Events Archive


 

Webcast: "Back to Basics: Measurement-Based Channel Modeling for Signal Integrity using Agilent ADS"

Overview:

In this webcast, we demonstrate a rapid technique for "what if" analysis for signal integrity applications.

We first automatically fit an ADS circuit model to measured data, using a Tyco XAUI backplane as an illustrative example. Next, the circuit model is used in a series of "what if" simulations to that show what configuration changes will lead to the required performance. Examples include changes to the loss tangent, the via design, and daughter card/backplane trace impedance matching, and combinations of all three. This technique is a much faster and more thorough approach to explore the design space than "iterating the hardware to success."

Who should view this webcast:

Signal integrity engineers for multigigabit links who are running into effects previously only seen in RF and microwave circuits.

View this webcast:

Fore a complete archived version of this webcast, please click on the following link:

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Hands-on Workshop: Signal Integrity Design, Analysis, and Verification


Overview:

At multigigabit per second data rates and with channel flight times longer than a bit period, signal integrity is a major concern. Under these conditions, high-speed analog effects, previously only seen in high frequency RF and microwave engineering, can impair the signal quality and degrade the bit error rate of the link. This hands-on workshop will show you how use Advanced Design System (ADS) to dramatically reduced product design cycles by resolving these issues early in the design cycle.

Using PCI Express serial link as an example, we’ll illustrate how you can:

  • Analyze complete serial links by co-simulating individual components, each at its most appropriate level of abstraction: link-, circuit- or physical-level.
  • Import S-parameter backplane and interconnect models accurately into transient (SPICE) simulations.
  • Perform jitter diagnosis with the proven EZJIT Plus algorithm used in Agilent instruments.

Presentation Materials

ADS Workshop on PCI-Express (.ppt, 21 August 2008, 1.6MB)

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On-Demand Webcast: Co-simulation Enables Efficient Co-Design of WLAN Antenna and Circuitry

Thank you for your interest in the Agilent Technologies Webcast,"Co-simulation Enables Efficient Co-Design of WLAN Antenna and Circuitry", held on May 28, 2008

If you were unable to attend the original broadcast, or would like to review the On-Demand version, please follow this link.

After viewing the webcast we ask that you take just a couple of minutes to complete the feedback form. By doing so your name will be entered into a drawing to win a $75 amazon.com gift certificate.

Please note that a PDF of the presentation will be available for download once you are inside the on-demand user interface. To find the PDF and other valuable information, click on the Additional Resources button.

If you have any questions when accessing the On-Demand version, please contact TechOnline Webinar technical support at .

Overview of this Webcast

To better streamline the design of wireless appliances, co-simulation is essential in today's EDA tools. RF & Microwave engineers can enjoy such a capability when employing Agilent's Advanced Design System (ADS) with integrated system, circuit, and EM (2D & 3D) simulation solutions. This hour long webcast illustrates the value of using a seamless co-simulation platform while exploring the co-design of a WLAN polarization diversity antenna with its associated circuitry.

Who should view this webcast

Wireless, Aerospace Defense Antenna Designers


For a complete archived version of this webcast, please click on the following link:

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Genesys 2008 & Momentum GX Workshop: Deliver First Pass Accuracy
March 2008, Various Cities & Dates

Genesys/Momentum GX Workbook - PDF, 4.59 MB

Agilent Genesys 2008 product offering provides self-supporting RF design teams and individuals with affordable, high-performance circuit and system design tools.

Genesys 2008 reduces costs for traditional RF & microwave planar design by:

  • Accelerating time-to-market with key productivity advantages, and an innovative array of simulation technology
  • Saving board turns with features for high-yield design, and integrated tools for physical design and EM simulation
  • Lowering the requirements for training and support staff
  • Very attractive pricing for both software and annual support

Topics covered:

Dual Band WiFi Design from System Architecture through PCB Layout including:

  • An overview of Agilent Genesys 2008 high-frequency design environment
  • Spur Free IF Planning with WhatIF
  • System Architecture using Spectrasys
  • Synthesize the WiFi Microwave Filter using M/Filter
  • Electromagnetic simulation with Momentum GX

Packages starting at $4,000 U.S. include linear S-parameter simulation, component parts libraries, substrate libraries, data post-processing, RF-aware layout, and layout import/export translators with one year technical support and software upgrades. More information.

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3GPP LTE Technology Overview and Testing Needs Workshop
26 February 2008, Winnersh, UK

A joint Agilent and Anite FREE Technical Workshop

Why this event is important?

3GPP Long Term Evolution (LTE) is the Evolved UTRA project, which significantly enhances the current HSDPA/HSUPA based UTRA technology through variable bandwidth up to 20 MHz, a new air interface both on downlink (OFDMA) and uplink (SC-FDMA) and a new network design (SAE).

This FREE workshop will introduce the LTE technology, and explain the design and test challenges associated with deploying 3GPP LTE. During this full day workshop, we’ll cover practical physical layer measurement techniques from digital/baseband (DigRF/MiPi) to RF with vector signal generation and analysis for both downlink and uplink. We’ll also spend time explaining the solutions available for protocol development and conformance testing.

What to expect:

This will be an informative and very useful working session for engineers developing LTE devices and systems. You’ll get an update on the technology and measurement solutions with hands on demonstrations.

During the seminar breaks and lunch you will have time to network with industry colleagues and speak with applications engineers from Agilent Technologies and Anite.

Agenda

  • 09.00 : Registration and Coffee
  • 09.30 : Welcome and Introduction
  • 09.45 : Introduction to LTE Technology
  • 10.45 : Break
  • 11.00 : LTE Simulation and Physical Layer Test Solutions
  • 12.15 : Lunch
  • 13.15 : RF Parametric, Functional and RF Conformance Test
  • 14.30 : Break
  • 14.45 : Protocol Development Tools and Testing
  • 15.45 : Predicting the Future of Wireless
  • 16.30 : Close

Registration

Click the following link for more information and to register for this event.

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Seminar: Front-to-Back MMIC Design Flow with ADS 2008
February 2008, Andover, MA; Somerset, NJ; Columbia, MD

MMIC Design Flow - Complete, Fast, and Accurate

MMIC continues to be the enabling technology for T/R (transmit/receive) modules in phased array radars as well as PAs (Power Amplifier) and FEMs (Front End Modules) in wireless communication devices. The art of designing MMICs for high yield and speed-to-market is attainable with a robust design methodology in an integrated front-to-back design environment. This seminar will show you how to take advantage of the latest productivity enhancements in ADS 2008 to complete front-to-back MMIC designs. Beginning from selecting a PDK (process design kit) from a wide choice of MMIC foundries, a tightly integrated circuit, statistical, electromagnetic and system simulations are used in turn to efficiently optimize the MMIC performance in schematic and layout designs to meet yield and wireless standards compliance. The MMIC project management, layout design, 3D viewing and EM Simulation and Schematic / Layout Synchronization and DRC enhancements in ADS 2008 release will be highlighted in the seminar.

The following seminar presentations are now available:

  • High Yield MMIC Front-To-Back Design with ADS 2008 - 91 slides (PDF, 4.5MB)
    This paper discusses how to take advantage of the latest productivity enhancements in ADS 2008 to implement a robust methodology for high yield MMIC designs. Beginning with a process design kit from a wide choice of MMIC foundries, a tightly integrated circuit, statistical, electromagnetic and system simulations are used in turn to efficiently optimize the performance, yield and wireless standards compliance of your MMIC. Through this front-to-back MMIC design flow, you will learn the important methodology of: a) MMIC Design-for-Manufacturing (DFM) for optimizing yield and minimizing cost, b) Efficient and accurate MMIC layout using a judicious combination of auto and manual design synchronization coupled with DRC and full-3DEM verification, c) Co-simulating MMIC circuit within a system to verify compliance with wireless system standards for first pass acceptance by your end customers.
  • PDKs (Process Design Kits) for Front-to-Back Design in ADS - 19 slides (PDF, 823KB)
    Process Design Kits are an important capability that allow users to customize their own workflow, leverage past work and to share design IP with others. This paper discusses the ADS 2008 features that can improve a designer's workflow and increase design efficiency. We’ll discuss how Process Design Kits work, and explore the anatomy of an ADS Design Kit. We’ll also demonstrate an example of a complete front-to-back ADS PDK in operation from a commercial MMIC foundry.
  • Cripps' Method: Why Max Power Contours and Max Efficiency Contours are not the same - 8 slides (PDF, 1MB)
    Cripps method is widely used for PA (power amplifier) designs. This paper will provide PA designers with practical insight on why the Maximum Power Contours and the Maximum Efficiency Contours don't coincide, and how to design PA impedance matching networks to meet both power and efficiency requirements.
  • Design of a MMIC traveling wave amplifier in ADS - 20 slides (PDF, 432MB)
    Traveling Wave (Distributed) Amplifiers are very broad band designs covering a decade or several decades of frequency range. Distributed amplifiers were popular in the early days of MMICs because a single broadband design could fit many frequency requirements. Even as the number of MMICs customized for particular applications or frequency bands has grown, distributed amplifiers still find application where pulse integrity or "DC to daylight" amplification is needed. An updated distributed amplifier was designed and fabricated with the modern TriQuint's 0.5 um GaAs PHEMT process (TQPED) for comparison to the older 0.5 um GaAs MESFET process (TQHA). This paper shows the design process and the results of the measured MMIC versus linear and EM simulations, including re-simulations using measured PHEMTs devices from the same fabrication run for excellent agreement with the measured s-parameters and noise figure data.
  • Large signal model extraction of GaAs MESFETs and GaN HEMT - 46 slides (PDF, 1MB)
    This paper will explore the modeling successes and difficulties of GaN HEMT devices. Many of these issues can be generalized to other high power, high frequency devices. In our modeling flow, pulsed IV and pulsed S parameter data were used to extract terminal voltage dependencies of device parameters. Using these terminal voltage dependencies, model parameters for 30-150W devices were extracted based on a set of empirical model equations implemented in ADS. The models have been used to accurately predict performance of GaN HEMT high power amplifiers. Some of the examples of these models and the associated verification of the models will be demonstrated. Additionally, we will discuss ongoing work on the model to upgrade features that include:
    1. Self heating effects, which are critical for an accurate high power device model that is nominally biased near or beyond pinch off. RF drive will then cause increases in the power dissipation and channel temperature.
    2. Bias dependency of parameters, such as IV characteristics and device parameters. Introduction of bias dependency of these parameters allows the models to be used in a design environment where bias voltages are used to create the signal modulation such as a polar or envelope modulation scheme."

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Workshop: Advanced Design System 2008 Release - Productivity by Design
26 - 28 February 2008, Various Cities & Dates in Southern California

Enroll Now! You'll be able to select the date/city most convenient for you.

Advanced Design System (ADS) 2008 provides over 100% productivity improvements over previous versions for RF/Microwave, MMIC, RFIC, SI and Communication Systems designers. It offers full 3D-EM integration for complete EM verification with circuit-system design. In addition, it brings the most powerful integrated simulation for optimal performance & yield of RF-Mixed Signal Products.

What to expect:

In this interactive workshop, each student will use Agilent supplied PCs to use ADS and explore the value of the ADS 2008 release.

Who should attend?

Engineers, designers, and CAD Managers who are currently using or planning to use ADS in their RF/Microwave, MMIC, RFIC, SI and communication circuit and system designs. Existing designers can also experience and see the power of productivity improvements that ADS 2008 can bring in their day to day design activities.

Topics Covered

10:00am - 2:00pm, Lunch will be provided

Platform Improvements

  • Project Management - improved workspace organization & file management, drag & drop, copy/rename.
  • Design Navigation - mouse-scroll pan and zoom, window panning, transparent fill patterns.
  • Improved Layout - trace Interconnect with Via Insertion, Design Synchronization. Design Rule Checker & Pre-Production Editor Guarantees Correct Layouts.

Simulation Technology Improvements

  • Power Probe and S-parameter Probe
  • HSPICE® Compatibility
  • Simulated Annealing Optimizer
  • 3D Viewing with Z-Scaling and Cut plane of layout
  • "EMDS for ADS": New wire-bond wizard, and parameterized JEDEC format

How to Enroll

Seating is limited for this complimentary workshop and early enrollment is advised. You will receive an email confirming your enrollment along with directions to the workshop location.

Click the following link to register for this event.

We look forward to your participation in our COMPLIMENTARY workshop!

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IC-CAP European Learning Week
18 - 22 February 2008, Böblingen, Germany

Over the five days, a continuous series of training classes and workshops will be held covering basic and advanced topics of device characterization and device modeling using Agilent EEsof EDA's Integrated Circuit Characterization and Analysis Program (IC-CAP).

What to expect:

The schedule is modular, enabling you to choose any combination of topics. You can register for one or more days at your convenience. Classes cover a selection of material used in the popular IC-CAP customer training classes and will be led by Franz Sischka. Thursday will be split into two parallel courses, a 'New Features and Best Practice Workshop' (F. Sischka) and a 'PSP MOS Modeling Workshop', which will be held by our partner Dr. Thomas Gneiting (AdMOS GmbH Advanced Modeling Solutions).

Registration

Click the following link for more details and to register for this training event.

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Hands-on workshop - Solving Gigabit SI problems and What’s New in ADS 2008 SI tools
12-13, February 2008, Anaheim, CA & San Diego, CA

Enroll Now! You'll be able to select the date/city most convenient for you.

The Advanced Design System (ADS) provides a complete Signal Integrity circuit simulation flow. It's important to use the right tool for the right job. Come experience how ADS offers complete design integration to designers of products such as high speed backplane, IC, Storage, Networking and Communication Systems.

What to expect:

In this interactive demonstration, the instructor will provide simple & efficient ways to simulate using ADS. By the end of the day, students will be more aware of the general capabilities and be much more productive with Advanced Design System when they return to work.

Who should attend:

Engineers, designers, and high-level technicians who need to use ADS for design, testing and characterization of circuits and systems.

Agenda

10:00am - 2:00pm, Lunch will be provided

  • Overview of ADS & Agilent Test Equipment
  • Getting Started with ADS, a simple example
  • Perform S-parameter, Transient
  • Post processing, Eye Diagram, Jitter
  • Backplane example
  • Generate a layout
  • Perform Momentum (EM) analysis

How to Enroll

Seating is limited for this complimentary workshop and early enrollment is advised. You will receive an email confirming your enrollment along with directions to the workshop location.

Click the following link to register for this event.

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DesignCon 2008
5 - 6 February 2008, Santa Clara Convention Center, Santa Clara, CA


Come see us at booth 305 and see our latest Signal Integrity Solutions in ADS 2008, including HSPICE Compatibility and the Altera Stratix II GX Transceiver Model Library Demo. See the solutions designed to help you gain insight into your digital designs.

Don't miss this presentation in conjunction with Tyco Electronics, "The Need for Impulse Response Models and an Accurate Method for Impulse Generation from Band-Limited S-Parameters".

Gain knowledge on how to provide interconnect models that will improve the accuracy of time domain simulations.

Click the following link for more details on this event.

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Seminar: Next Generation High-Speed & Wireless Design Using Advanced Design System (ADS)
17 January 2008, Burnaby, BC and 22 January Calgary, AB

Why Attend?

The Advanced Design System (ADS) provides a complete Signal Integrity & Wireless circuit simulation flow. It's important to use the right tool for the right job. Come experience how ADS offers complete design integration to designers of products such as high speed backplane, IC, Storage, Networking, Wireless, WiMAXTM and Communication Systems.

What to expect:

In this interactive demonstration; the instructor will provide simple & efficient ways to simulate using ADS. By the end of the day, students will be more aware of the capabilities of ADS and be much more productive with Advanced Design System when they return to work. The instructor will also review examples from applications such as Signal Integrity, EM, RFIC and Wireless Systems.

Who should attend?

Managers, engineers, designers, and high-level technicians who are involved in challenging high-frequency designs in Signal Integrity, RFIC and Wireless market segments.

Agenda

10:00 - 2:30 - Lunch will be provided

Overview of Advanced Design System 2008 - What's New in ADS2008 Signal Integrity EM Simulations RFIC and Wireless System Simulations.

Seating is limited for this complimentary seminar and early enrollment is advised. You will receive an email confirming your enrollment along with directions to the seminar location.

Registration

Click on the following link to register for this free seminar:

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Webcast: WiMAXTM Wave 2 Testing -- MIMO & STC
17 January 2008 10:00 am PST

This webcast explains measurement and troubleshooting techniques for Wave 2 of the WiMAXTM broadband mobile networking standard. In particular, Wave 2 includes several multi-antenna techniques such as multiple-input multiple-output (MIMO) and space-time coding (STC).

Efficient design and test of multi-antenna devices does not always require multiple source and receiver channels. This webcast describes both single- and multi-channel signal generation and analysis techniques along with the results that can be obtained by the various approaches. We will cover specific signal quality and performance measures related to the various multi-antenna configurations, and how these measures can be used to optimize designs. We will also review several simulations with embedded measurements to better understand MIMO behavior and evaluate design trade-offs.

Who should view this Webcast?

This webcast presents valuable information for WiMAXTM reference designers, module integrators and manufacturers.

Giveaway

Registrants who completely fill out the feedback form by April 17, 2008 will be eligible to win one of two $75 Amazon.com gift certificates.

Registration

Click on the following link to register for this free webcast:

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High-Speed Digital Design Seminar - Ensuring MultiGigabit Design Success
15 - 24 January 2008, Various Cities

Why this seminar is important

Today's digital designs feature high-speed serial I/O technology like PCI Express, Fibre Channel, Fully Buffered DIMM, DisplayPort, etc., with data rates >2.5 Gb/s, embedded clocks, differential signaling, and layout density that makes probing difficult. Knowing how the latest tools can accelerate the design and validation process helps you get your products to market faster. At this event, you will learn about recent breakthroughs in test technology that enable designers to tackle their greatest high-speed digital design and validation challenges more efficiently and effectively than ever before.

What to expect:

You are invited to this complimentary full-day seminar, where you will see the latest high-speed digital, signal integrity, and jitter analysis innovations focusing on both design and validation solutions from Agilent Technologies. You will learn about the most advanced applications, solutions, and technologies in high-speed digital areas such as signal validation of high-speed interconnects/buses, jitter analysis of digital signals, physical-layer measurements of components and backplanes, and protocol analysis. Unique solutions will be discussed along with approaches that support the higher data rates of future implementations.

In addition, Agilent technical experts and application engineers will be available for informal discussions about your unique application. The most advanced solutions for high-speed digital design and verification will be demonstrated.

Who should attend?

This seminar will be valuable to engineers in a number of industries where new high-speed memory, I/O, or communications technologies are being implemented.

Seating is limited! Enroll Now!

You will be able to select the date/city most convenient for you.

After you enroll, you will receive a confirmation with a map to the location. You will also receive a reminder a few days before the seminar.

Registration

Click on the following link for more details and to register for this training event.

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European Genesys Training Days
15 - 17 January 2008, Winnersh, UK

These training days will offer a continuous series of training classes with hands-on labs covering a wide range of topics about the Genesys RF- Microwave Design Software.

What to expect:

The first two learning days will cover the Basics of Genesys, various Synthesis-Modules, Linear- and Non-linear Circuit Simulation, Layout and EM-Co-Simulation. The third day will focus on System Simulation (RF Architecture). You can register for one or more days at your convenience but we recommend you start with Genesys Basics, followed by Linear Analysis. If you are already an experienced user of Genesys you can also register for the third day (System Simulation) only. Computers will be provided by Agilent for those who do not plan to bring their own laptop.

Registration

Click on the following link for more details and to register for this training event.

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Seminar: EEsof RFIC Design Seminar - "Tackling the Tough Problems"
15 January 2008, Andover, MA

Why Is This Seminar Important?

RFIC design is becoming increasingly difficult, due to:

  • Higher level of circuit integration
  • Increasing complexity of communication standards
  • More inclusion of digital circuitry
  • Use of advanced, smaller geometry processes with larger process variations

In addition, designs are typically under characterized due to schedule pressures, and there is minimal investment in understanding the manufacturability and yield at the design stage.

This half-day seminar will provide insight and practical design methodology suggestions for tackling these challenging demands and achieving a higher likelihood of first time success for RFIC designs using the Agilent EEsof RFIC EDA tools.

What to expect

Three one-hour presentations by Agilent experts will provide a practical overview of solutions addressing the key design challenges of RFICs: Noise; Design for Yield; complex modulated signals and their interaction on chip; and how to handle large highly integrated design characterization even with fully extracted parasitics. The GoldenGate circuit simulator, which is fully integrated into the Cadence custom IC environment, will be highlighted, along with unique capabilities of other Agilent RFIC design tools that can improve your productivity. As a result of attending this seminar, designers will understand how to decrease design spins, increase manufacturability and reduce overall design risk using GoldenGate.

Proposed Papers

  • "Designing for Yield in Advanced RFICs - Tools for Success"
  • "Speed Verification of Integer-N RFIC PLLs Using Harmonic Balance"
  • "Cross Modulation in a Full Duplex Transceiver - Cause, Effects, and Simulation"

Registration

Click on the following link to register for this seminar:

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Webcast: Novel Design Techniques for First Pass RF Board Design
10 January 2008, 10:00 am PST

Industry expert, Lance Lascari, will discuss RF Board design challenges by presenting different application examples each highlighting unique design and simulation challenges. The presentation will include design examples such as low noise-high dynamic range-broadband amplifier, a printed bandpass filter, and a printed patch antenna.

The focus of this presentation will be on design and simulation techniques as well as design tricks RF/microwave engineers can easily employ to further improve their design efforts' efficiency.

Who should view this Webcast?

RF Board designers, antenna designers, filter designers, amplifier designers.

Giveaway

Registrants who completely fill out the feedback form by March 10, 2008 will be eligible to win one of two $75 Amazon.com gift certificates.

Registration

Click on the following link to register for this free webcast:

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Quick Start Training for Engineers New to ADS
6 December 2007, Santa Clara, CA - Agilent Technologies

A Complimentary Seminar Presented by Agilent EEsof EDA

The Advanced Design System (ADS) provides a complete Signal Integrity circuit simulation flow. It's important to use the right tool for the right job. Come experience how ADS offers complete design integration to designers of products such as high speed backplane, IC, Storage, Networking and Communication Systems.

What to expect:

In this interactive demonstration, Instructor will provide simple & efficient ways to simulate using ADS. By the end of the day, students will be more aware of the general capabilities and be much more productive with Advanced Design System when they return to work.

Who should attend?

Engineers, designers, and high-level technicians who need to use ADS for design, testing and characterization of circuits and systems.

Agenda:

  • 11:30 - 1:30 - Snacks will be provided
  • Overview of ADS & Agilent Test Equipment
  • Getting Started with ADS, a simple example
  • Perform S-parameter, Transient
  • Post processing, Eye Diagram
  • Generate a layout
  • Perform Momentum (EM) analysis

Registration

Click on the following link to register for this free seminar:

Note: Seating is Limited for this complimentary seminar and early enrollment is advised. You will receive an email confirming your enrollment along with directions to the seminar.

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Webcast: Simulation and Design of Software Defined Radios (SDR)
28 November 2007, 10:00 a.m. - 11:00 a.m. PDT (1:00 p.m. - 2:00 p.m. EDT)

This webcast discusses the simulation, design and test of Software-Defined Radios (SDRs) applicable to both military and commercial applications.

The system performance is evaluated first using a 16-QAM legacy waveform for Spectral mask and EVM. Following this, a new SDR waveform is introduced - Orthogonal Frequency Division Multiple Access (OFDMA) - and the system performance is analyzed and compared with the legacy waveform results.

The implementation of the RF transmitter, receiver and channel models and their effects on system performance are be shown. The presence of potential interference and jamming signals at various RF frequencies and power levels and their effects on overall systems performance are evaluated.

Software simulation and test instrumentation are then combined to test the Xilinx Field Programmable Gate Array (FPGA) hardware with the RF system model, all embedded within an Agilent Logic Analyzer, to create a Software Defined Instrument which allows one box testing of a SDR, including full RF transmitter, link and receiver models with real signals being processed through them.

Giveaway

Attendees who complete the online evaluation form by February 28, 2008 will be entered in a drawing to win a $75 Amazon.com gift certificate.

Registration

Click on the following link to register for this free webcast:

Webcast: Simulation and Design of Software Defined Radios (SDR)

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3D EM Hands-on Workshop
6 November 2007, Andover, MA

In this free hands-on workshop, attendees will use Agilent-supplied computers to work through instructor-led labs using "EMDS-for-ADS" and AMDS. Example structures include bondwires, finite dielectric bricks, and various types of antennas, and attendees will see how to set up and simulate these structures using "EMDS-for-ADS" and AMDS.

Electromagnetic Design System (EMDS) is a complete solution for electromagnetic simulation of arbitrarily-shaped, passive three-dimensional structures. It provides the best price/performance, 3D EM simulator on the market. EMDS includes a full 3D FEM (Finite Element Method) electromagnetic field solver, a solid modeling front-end, and fully-automated meshing and convergence capabilities for modeling arbitrary 3D shapes such as connectors, machined parts, components, bond wires, antennas, and packages.

"EMDS-for-ADS" is a fully integrated version of EMDS inside of ADS Layout:

  • Use directly from ADS Layout.
  • Include simulation of bond wires and dielectric bricks (finite dielectrics).
  • New, user-friendly 3D viewer.
  • Create parameterized EM components for circuit co-simulation.
  • Momentum-like usage and flow.
  • View currents, EM fields & radiation.
  • View results with data display.
  • Includes 64-bit simulation capability.

Antenna Modeling Design System (AMDS) is the only 3D EM antenna design tool that addresses the challenges of fast changing wireless appliance design dictated by consumer aesthetic and feature appetite. AMDS provides time domain EM analysis which allows you to simulate antenna structure and placement within the appliance in the presence of real world proximity effects of the human head and hand to determine parameters such as detuning and sensitivity.

Innovative uncompromising technology efficiently imports, meshes and simulates the entire wireless appliance within its surrounding real-word environment. It enables you to pass regulatory and operator compliance such as Over-The-Air-performance and SAR (Specific Absorption Rate) and HAC (Hearing Aid Compatibility) before going into expensive physical testing.

Agenda

8:30 a.m. - 4:00 p.m.

8:30 a.m. - 9:00 a.m.

Registration

9:00 a.m - 12:00 noon

"EMDS-for-ADS" Hands-on

12:00 noon - 1:00 p.m.

Lunch (provided)

1:00 p.m. - 4:00 p.m.

AMDS Hands-on

Registration

Click on the following link to register for this free workshop:

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EPEP 2007: Electrical Performance of Electronic Packaging
29 - 31 October 2007, Renaissance Atlanta Hotel, Atlanta, GA

The Electrical Performance of Electronic Packaging (EPEP) meeting is recognized as the premier technical meeting on electrical considerations in packaging. Visit the Agilent Technologies display, where we will be featuring demos of Signal Integrity analysis using Advanced Design System (ADS) and of the Physical Layer Test System (PLTS).

Click on the following link for complete meeting information:

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MILCOM - 2007 Military Communications Conference
29 - 30 October 2007, Gaylord Palms Hotel, Orlando, FL

MILCOM has been the premier international conference for military communications, with over 3,000 attendees every year.

MILCOM 2007 will attract decision-makers from government, military, academia and industry, including the heads of multi-national forces from around the globe, all who contribute to key technologies decisions and investments for their agencies and organizations.

MILCOM also attracts the best and brightest communication subject matter experts from these market segments, to discuss in-depth the latest in technology advancements

Visit the Agilent Technologies Booth #1529.

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Webcast: Why Do Measurement-Based Channel Modeling?
18 October 2007, 10:00 a.m. - 11:00 a.m. PDT (1:00 p.m. - 2:00 p.m. EDT)

This presentation discusses various measurement and modeling techniques that are used to characterize today's high speed digital channels.

Basics of VNA calibration techniques, S-parameter de-embedding, mixed mode S-parameters, TDR, eye diagram, and jitter will be covered, using ADS (Advanced Design System) and PLTS (Physical Layer Test System) as signal integrity analysis tools.

Key topics include learning which performance figures-of-merit are most important and how to assure good correlation between measurements and modeling, identifying basic channel topology in multiple domains, and optimizing designs for high speed.

Giveaway

Registrants who complete the feedback form will will be entered in a drawing to receive an autographed copy of Eric Bogatin's book, Signal Integrity Simplified.

Registration

Click on the following link to register for this free webcast:

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Webcast: Concepts of 3GPP LTE
20 September 2007

LTE is heading your way - are you prepared? Following just behind HSPA, LTE is 3GPP's answer to WiMAXTM. This is the first of two webcasts from Agilent on LTE.

The present webcast covers what LTE is and where it came from and provides context against the other 3.9G technologies such as HSPA+ and WiMAXTM.

Webcast: Addressing the Design and Verification Challenges of 3GPP LTE
2 October 2007

This webcast investigates system design and verification challenges of 3GPP LTE and show how Agilent's new design simulation capabilities can help. A case study will be presented to highlight system design considerations and performance trade-offs for 3GPP LTE transmitter/receiver design.

Various system design trade-offs are examined, including the effects of baseband bit width, phase noise, and power amplifier non-linearities on key system performance metrics such as Error Vector Magnitude (EVM). Uncoded raw Bit Error Rate (BER) is also investigated.

This webcast concludes by showing how Agilent's simulation environment seamlessly integrates with Agilent signal generator and analyzer products to enable R&D testing of early LTE hardware.

Archive Versions


Click on the following link for the archive versions of both of these free webcasts:

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2007 High-Speed Digital Design Seminar - Ensuring MultiGigabit Design Success
25 September - 1 November 2007, twelve locations in the United States and Canada

Attend this complimentary full-day seminar to see the latest high-speed digital, signal integrity, and jitter analysis innovations focusing on both design and validation solutions from Agilent Technologies.

You will learn about the most advanced applications, solutions, and technologies in high-speed digital areas such as signal validation of high-speed interconnects/buses, jitter analysis of digital signals, physical-layer measurements of components and backplanes, and protocol analysis.

Unique solutions will be discussed along with approaches that support the higher data rates of future implementations.

In addition, Agilent technical experts and application engineers will be available for informal discussions about your unique application. The most advanced solutions for high-speed digital design and verification will be demonstrated.

Measurement-based Channel Modeling

Agilent EEsof EDA engineers will present the seminar session titled Why Do Measurement-based Channel Modeling?

This presentation discusses various measurement and modeling techniques that are used to characterize today's high speed digital channels. Basics of VNA calibration techniques, S-parameter de-embedding, mixed mode S-parameters, TDR, eye diagram, and jitter will be covered utilizing the ADS (Advanced Design System) and PLTS (Physical Layer Test System) as signal integrity analysis tools.

Key learnings will include knowing which of the performance figures-of-merit are most important, how to assure good correlation between measurements and modeling, identifying basic channel topology in multiple domains, and optimizing your design for high speed.

Seminar Dates, Locations, and Registration

Click on the following link for complete seminar information, including a detailed agenda:

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RF Board Design for Next Generation Wireless Systems
29 August 2007

The IEEE 802.16e standard, often referred to as mobile WiMAX, specifies air interfaces for broadband wireless access (BWA) systems. The standard is expected to energize the BWA industry and open many opportunities to deploy systems in applications that were previously cost-prohibitive. Mobile WiMAX uses roaming and handoff to enable laptop and mobile phones to operate.

MIMO technology addresses some of these issues by extending high throughput and improving network capacity. Despite these benefits, cost and power consumption will continue to be a challenge for designers — especially when they are trying to achieve optimal system performance. Agilent GENESYS users can now access an industry proven, 3D-Planar electromagnetic simulation technology, Momentum GX, to help them optimize and verify the physical performance of their WiMAX high-frequency circuits and interconnects within the GENESYS design flow.

For a complete archived version of this webcast, click on the following link:



RFIC Design Seminar: "Tackling the Tough Problems"
24 - 26 July - San Diego, Irvine, Santa Clara, CA

RFIC design is becoming increasingly difficult with: higher level of circuit integration; increasing complexity of communication standards; more inclusion of digital circuitry; and use of advance, smaller geometry processes with larger process variations.

Designs are typically under characterized due to competitive and schedule pressures, and there is minimal investment in understanding the manufacturability and yield at the design stage.

This half-day seminar, with one-hour presentations by industry and Agilent experts, provides insight and practical design methodology suggestions for tackling these challenging demands and achieving a higher likelihood of success.

Key topics will be: noise, design for yield, complex modulated signals and their interaction on chip, and how to handle large, highly integrated design characterization even with fully extracted parasitics.

The GoldenGate circuit simulator, which is fully integrated into the Cadence® custom IC environment, will be highlighted. As a result of attending this seminar, designers will understand how to decrease design spins, increase manufacturability and reduce overall design risk using GoldenGate.

RFIC Design Seminar Presentations

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Webcast: Introduction to "EMDS for ADS"
26 July 2007, 14 June 2007, 15 May 2007

"EMDS for ADS" is Agilent's integration of EMDS (Electromagnetic Design System, a full 3D FEM solution) into the ADS (Advanced Design System) flow. This valuable solution provides RF and Microwave engineers the ability to access full 3D EM technology in a flow that is virtually identical to the Momentum 3D planar flow that exists today.

Three different webcasts are available. The July 2007 session shows simulations of various spiral inductors using "EMDS for ADS." The June 2007 session focuses on a demo of the software. The May 2007 session shows a typical application, the simulation of bond wires.

Click on the following links to choose and run the archive version that you prefer and to download the associated overhead slides and ADS project files:

July 2007 Session

June 2007 Session

May 2007 Session



New Signal Integrity Design Tools and Methods for High-Speed Digital Communications - United States and Canada, 27 March - 17 May 2007

With World-Renowned Experts: Dr. Eric Bogatin, Bogatin Enterprises, and Al Neves, Teraspeed Consulting

The following seminar papers are now available:

Successful, fast and cost-effective high-speed data link design requires an exact process that prevents over-specifying or over-designing hardware. The key to success is a set of integrated EDA tools that combines accurate time-domain simulation of available data and models with comprehensive system-level verification.

Attend this free Signal Integrity design seminar and learn how the new technology in Agilent's ADS delivers the capability you need to achieve first-pass success. Product demonstrations and papers by SI experts, including renowned SI design consultants from Bogatin Enterprises and Teraspeed Consulting, will provide you with comprehensive solutions to the tough signal integrity problems designers are facing today.

Expect to see the latest simulation, modeling, signal integrity, and jitter analysis innovations focusing on both design and validation solutions from Agilent Technologies. You will also have an opportunity to interact with Dr. Bogatin and other topic experts.



RF Circuit Synthesis for Physical Wireless Design, 28 March 2007

Wireless RF designs have moved higher in frequency, making circuit design tasks more difficult. This webcast shows how modern Circuit Synthesis tools such as GENESYS enable faster RF design by automating the creation of routine matching networks, filters, couplers, baluns, and other structures, yet allow physical and statistical analysis to insure manufacturability.

For a complete archived version of this webcast, click on the following link:



Webcast: New RF Architect Design Tools for ADS 2006A
16 November 2006

WhatIF, SPECTRASYS, and SYNTHESIS are three RF architecture tools that improve the front end of the RF design cycle. These unique, proven products now connect directly to the ADS 2006A design flow.

WhatIF, SPECTRASYS, and SYNTHESIS make it possible to design the "right" RF Systems, with the optimum partitioning of function blocks and Intermediate Frequencies. You start your designs "closer to the finish line" and can also avoid many implementation problems later in the design process.

In this complimentary webcast, we explore the advantages of integrating these tools into your current design flow, using with the new releases of ADS and GENESYS.

The webcast shows in detail the RF Architecture design and implementation of a dual band WLAN down-converter using WhatIF, SPECTRASYS and SYNTHESIS to account for spurs, noise figure, feedthru terms, nonlinearities, and real implementation effects.

The design is then transferred to ADS 2006A, where the implementation is completed and then verified with EM and system-level tools for WLAN and WiMax applications.

For a complete archived version of this webcast, click on the following link:



European Webcast: Characterization of Discontinuous RF/uW Passive Components Using EEsof's New Full 3D Electromagnetic Simulator
28 September 2006

This webcast session, for the European time zone, presents simple techniques for efficient design of discontinuous high-frequency passive circuits using a new 3D electromagnetic (EM) simulation tool. During the course of the presentation, Dean Nicholson, an accomplished RF design engineer, will demonstrate how correct-by-design RF passive circuitry can be attained without the need for resource-intensive physical prototyping. Two different passive circuit elements will be discussed; including wire-bonding techniques used between transmission lines, spiral inductors, and capacitors. Simulated versus measured data will be presented.

For a complete archived version of this webcast, click on the following link:

For the complete set of overhead slides used for this webcast, click on the following link:



Webcast: Design and Characterization of Discontinuous RF/uW Passive Components Using EEsof's New Full 3D Electromagnetic Simulator
21 September 2006

This webcast session presents simple techniques for efficient design of discontinuous high-frequency passive circuits using a new 3D electromagnetic (EM) simulation tool. During the course of the presentation, Dean Nicholson, an accomplished RF design engineer, will demonstrate how correct-by-design RF passive circuitry can be attained without the need for resource-intensive physical prototyping. Two different passive circuit elements will be discussed; including wire-bonding techniques used between transmission lines, spiral inductors, and capacitors. Simulated versus measured data will be presented.

For a complete archived version of this webcast, click on the following link:



Eye Openers - Tools and Techniques from Today's Leaders in Signal Integrity Design
United States and Canada, September 2006

The Eye Diagram is one of the more familiar measurements in the Signal Integrity community. Attend our complimentary seminar and see the latest eye-opening innovations in modeling, signal integrity and jitter analysis, focusing on both design and validation solutions.

Take this opportunity to interact with Bogatin Enterprises, and Teraspeed Consulting, two of the leading industry experts in signal integrity. Technical papers and product demonstrations will be presented by technical experts and applications engineers. This seminar will "open your eyes" to new design possibilities.

Click on the following links for archive copies of the slides for each of the seminar papers:



Webcast: New EDA Tools for Aerospace Defense
19 September 2006

Are you constantly being driven to develop more complex designs in a shorter time frame? EEsof EDA would like to invite you to a one-hour webcast introducing new EDA tools for Aerospace/Defense that can help you meet these challenges.

  • Discover how to quickly and easily create and verify signal processing designs for radar and communication systems using SystemVue.
  • See how Agilent EEsof's RF Architecture Design Tools using WhatIF and Spectrasys, accessible from within ADS 2006A, can quickly and easily account for all signals and signal paths in your RF system and identify the root causes of design failures early in the development process.
  • Learn how new enhancements in ADS 2006A get your designs started closer to finish line.
  • Be introduced to our new, low cost, full 3D EM simulator for designing accurate microwave components.

For a complete archived version of this webcast, click on the following link:


Webcast: WiMedia UWB PHY Simulation and Test
24 August 2006

New wireless networking standards commonly present design challenges at the physical layer, which in turn present circuit simulation and testing challenges. The WiMedia MB-OFDM UWB signal with its low power, hopped, 528 MHz wide OFDM format is a current example which will have broad impact as the base technology for Certified Wireless USB and next generation Bluetooth. This e-seminar will review WiMedia's MB-OFDM PHY layer structure and discuss various MB-OFDM testing topics, including transmitter analysis, receiver stimulation and evaluation, and using simulations during circuit design to improve device immunity to interference.

For a complete archived version of this webcast, click on the following link:


Webcast: Meeting the Challenges of High Speed Signal Integrity Design
23 August 2006

The multi Gb/s data rates of today's high speed digital systems present designers with tremendous challenges. Higher frequencies mean that SI engineers are faced with effects that just a few years ago were the concern of Microwave engineers. This e-seminar shows how the power and breadth of Agilent's ADS in the high frequency design space has been focused to ensure success in the many different aspects of SI design. Also described is the unique capability of ADS to integrate these functions into an interactive link simulation, allowing verification and optimization of a complete system.

For a complete archived version of this webcast, click on the following link:


Seminar Tour: Signal Integrity Solutions for High Speed Design

United States and Canada, 15 May - 9 June 2006

Measurement-based modeling plays an important role in the design of a successful high speed interconnects.

Various time- and frequency- domain measurements such as eye diagrams, S-parameters, and TDR/TDT responses help designers understand the behavior of a complete interconnect or any portion of it. Designing a high speed interconnect successfully requires that every component in a digital signal path be properly characterized and validated against measured data.

This seminar will make you efficient in understanding various eye diagram measurements and de-embedding techniques in ADS which are essential for your everyday signal integrity design work.

Presentations Archive

Click on the following links for the seminar presentations:

Power-of-Two: New Releases of Agilent Technologies ADS / Eagleware GENESYS

A Complimentary Seminar Presented by Agilent EEsof EDA, various locations, United States and Canada, April - May 2006

In today's competitive market, it is more important than ever to have the best design solutions available. Having the appropriate design software will help decrease time-to-market and avoid expensive iterations of your designs.

Agilent Technologies is proud to offer two software packages to assist with those easy and hard-to-solve problems that you run into on a daily basis. Come learn about the new release of Agilent Technologies Advanced Design System (ADS) 2005A, how you can use Eagleware GENESYS 2005 for RF System Architecture Design, and how ADS and GENESYS work together today and will work in the future.

Seminar highlights include:

Eagleware GENESYS 2005

  • Three Industry-First New Tools: WhatIF frequency planning, Mixer synthesis module.
  • Time Domain Simulator - Cayenne.
  • Many Tool Enhancements - HARBEC, differential filters, speed and accuracy improvements.
  • New User Interface - Files, designs, menus are consistent across platforms and easier to use. Workspace tree offers intuitive design management.

Agilent Technologies ADS 2005A

  • Simulation Technology Improvements: Speed, Strength, Intelligence, Spectre Compatibility.
  • Improvements in Momentum 3D EM Simulator - xr - e.g. 64-bit, Thick Conductor Modeling.
  • Gerber-Union Import/Export.
  • Agilent/CST Alliance.
  • Many new ease-of-use enhancements.

Presentations Archive

Click on the following link for an archive version of the complete seminar presentation:


TechOnLine Seminar - Hacking the Backplane: Complete Differential Channel Characterization and Analysis from 4-port Measurement

18 April 2006

Absolutely everything you ever wanted to know about the electrical performance of a differential channel is contained in its 4-port S parameters. These can be displayed in the time domain or the frequency domain and as single ended or balanced. The information locked in these terms can be used to feedback to the design of the backplane or feed forward to evaluate the performance of the backplane in system level applications.

This seminar shows how to data mine this rich source of information to unlock the channel's secrets such as its differential impedance profile, the skew between lines, mode conversion, possible radiated emissions, the bandwidth of the interconnect, its rise time degradation, the expected eye diagram, and how to extract RLGC models of the channel for system level simulation.

If your design uses differential pairs, the techniques illustrated in this presentation will show you how to open up a new window to clearly see exactly how they are performing.

The seminar is presented Dr. Eric Bogatin, a widely-recognized expert on signal integrity and Chief Technology Officer at Interconnect Devices, Inc. (IDI) in Kansas City, KS, as well as President of Bogatin Enterprises.

Click on the following link to view the archive version of the seminar. A brief registration is required.


WebEx Seminar - Digital Predistortion of Wireless Power Amplifiers

23 March 2006

Spectral Efficiency is increasingly important in today's mobile communications. The non-constant envelope (high peak-to-average ratio) digital modulation schemes used in 2.5G and 3G wireless systems make RF Power Amplifier (PA) linearity and efficiency a crucial design issue. Typically, linearity is achieved either by reducing the efficiency or by applying linearization techniques.

In this WebEx seminar, you will learn how Agilent EEsof ADS helps designers create and efficiently simulate PA linearizer systems. An example of a Doherty amplifier with a digital pre-distortion system will be shown.

View the archive version of this webinar presentation at the following link. Registration and agreement to the Terms and Conditions is required.


WebEx Seminar - Agilent EEsof EDA HSPA Wireless Library

16 March 2006

Are you thinking about designing or verifying High Speed Packet Access (HSPA) RF and baseband chipsets or modules?

High speed uplink packet access (HSUPA) is an add-on technology for W-CDMA that allows higher uplink data rates and complements High Speed downlink packet access (HSDPA). HSPA refers to both improvements made in the UMTS downlink and uplink. These changes are reflected in both release 5 and release 6 of 3GPP standards.

The HSPA wireless library provides preconfigured simulation setups, signal sources and fully coded bit error rate analysis for simulation of the circuitry used in 3GPP fast uplink designs. It helps speed the development cycle by allowing system designers to analyze a system’s performance before all of its components are designed.

In this free WebEx seminar, we will review HSPA PHY layer, discuss system level design and verification considerations, and describe an integrated software/hardware design flow for component design and verification.

View the archive version of this webinar presentation at the following link. Registration and agreement to the Terms and Conditions is required.


WebEx Seminar - SPECTRASYS for RF System Design

Webinar Archive: 14 March 2006

Presented for the first time on 14 March 2006, the web seminar focuses on RF system design with the GENESYS tools SPECTRASYS, WhatIF, and Synthesis. It consists of a brief overview of product capabilities, followed by a detailed demonstration presented by Rob Lefebvre, formerly Chief Technical Officer of Eagleware-Elanix.

Rob shows how SPECTRASYS, the industry's first and only continuous spectrum simulator can be used to speed RF system architecture design and pinpoint problems early when they are quick and easy to fix. SPECTRSAYS includes SPARCA, (Spectral Propagation and Root Cause Analysis) that shows immediately the source of problems like spurs and signal sneak paths.

WhatIF helps select spur-free IF bands for radio designs in a fraction of the time required by using spreadsheets or spur charts. Rob also introduces the GENESYS world-class synthesis portfolio. He covers general synthesis concepts, and present detailed synthesis examples including filters, matching networks, equalizers, and more.

View the archive version of this webinar presentation at the following link. Registration and agreement to the Terms and Conditions is required.


Circuit Synthesis with GENESYS

Webinar Archive: 11 January 2006

View the archive version of this webinar presentation at the following link. Registration and agreement to the Terms and Conditions is required.


System Architecture Design with SPECTRASYS

Webinar Archive: 16 November 2005

View the archive version of this webinar presentation at the following link: System Architecture Design with SPECTRASYS.

SPECTRASYS and WhatIF are the best places to start your RF system designs. WhatIF helps you select spur-free IF bands for your radio designs. SPECTRASYS includes the industry's first and only continuous spectrum simulator and includes SPARCA (Spectral Propagation and Root Cause Analysis) to pinpoint the sources design problems.

This webinar was recorded on 16 November 2005. Rulon Vandyke, the lead developer of SPECTRASYS, demonstrated this revolutionary technology. New users, users considering upgrading to GENESYS 2005, and ADS users will learn how they can easily add this technology to their existing design flows.

View the archive version of this webinar presentation at the following link. Registration and agreement to the Terms and Conditions is required.


Agilent EEsof EDA User Group Meeting
China, India, Taiwan, Korea, 27 August - 23 November 2005

The Agilent EEsof User Group Meeting (UGM) is a banner event for the high-frequency design industry in Asia each year. It is the annual fixture where designers come together to share ideas, discuss problems, and interact with application consultants from Agilent Technologies. Through each UGM, it is our hope that together with elite engineers from the industry we will build a stronger high-frequency design community in Asia.

For 2005, we successfully held five stops across China, India, Taiwan, and Korea. We had more than 500 attendees, and more than 35 elite engineers and researchers from the industry shared their design experience.

Click on the following link for a complete list of papers, including downloadable versions of many of them:

We look forward to your participation in 2006.


Power Amplifier Design - Using the Advanced Design System
USA, 5 - 21 April and 27 - 30 June 2005

This free two-hour lunchtime workshop shows the design of a 50 W Power Amplifier and its subsequent verification using real world complex modulated signals, all within the Agilent EEsof EDA Advanced Design System (ADS) environment.

The following topics are covered in detail:

  • DC and Loadline Analysis
  • Bias and Stability
  • LoadPull
  • Matching using Smith Chart Utility
  • SourcePull
  • PA Characterization - Did we meet the specification?
  • Optimize / Fine Tune the Design
  • Test Design with Real World Modulated Signals (QAM 16)
  • Layout

Seminar Archive

For archive versions of the PowerPoint slides and ADS project file used in this seminar, click on the following links:


Integrated RF Board Design Seminar: Concept to Fabrication
United States and Canada, 8 March - 26 April 2005, 13 - 28 July 2005

In this free half-day seminar, Agilent Technologies engineers will present the major steps in the design of an RF board using Advanced Design System (ADS), tracing a complete concept-to-fabrication flow of an integrated RF board design.

The seminar shows how to generate an accurate electromagnetic-simulation-based model of the RF board traces and how to integrate them into a final system-level simulation that includes budget analysis and optimization of the performance.

It shows how to build measurement-based models for components and how to build layout libraries for off-the-shelf components in addition to those typically available in Agilent's Advanced Design System software. This includes modeling the connecting transmission lines or matching networks.

The seminar also shows how to use the most popular file formats to send the board from drawing to fabrication house.

Seminar Modules

The following seminar modules will be presented. Agilent Technologies engineers will also be available for hands-on demonstrations and informal question-and-answer sessions.

Module 1. Top-Level System Design Using ADS Budget Analysis
This presentation will cover the design flow of a top-level RF system analysis. It introduces the Agilent ADS 2-port cascaded budget analysis. The paper will identify how to determine the culprit components through the use of parameter sweep, optimization, and real-time tuning. Examples will be provided to show how to set-up the schematic, make measurements, and display the results.   Download

Module 2. Modeling Off-the-Shelf Components Using Data Based or Parametric Models
One very important step in designing an RF system is to incorporate a good model. This paper presents the available component models in ADS and shows how to quickly build measurement-based models. One example highlighted will be how to build a nonlinear model using Agilent's Connected Solutions. It presents how ADS can be connected to a Network Analyzer to extract a nonlinear model and incorporate it back into ADS.   Download

Module 3. Creating Layout Libraries for Off-the-Shelf Components
Most vendor supplied component models are in the terms of electrical parameters. In order to ultimately connect these components on a RF board, a layout geometrical model has to be associated with it. This paper presents how to create the geometry, associate it with the electrical model, and make it available in the library.   Download

Module 4. Creating an EM-Based RF Board Model Using ADS and CST's Microwave Studio
The transmission lines that connect the components play an important role in the design of an RF board. This paper presents how one can incorporate the high frequency effects of these transmission lines on the overall system performance. It shows how to create an electromagnetic based parametric model and bring it back to the schematic in a user-friendly way. It also shows the possibility of further optimization by varying the parameters of this model.   Download

In some cases either MMIC or hybrid IC are used for various functional blocks (i.e. Amplifier, Mixer, Switch, and etc). These are connected to the RF board by bonding the input and output RF connections. To accurately model these bond wires one will need a 3D EM tool. For a complete analysis, the 3D EM models will be brought into the RF board as a circuit element. This is a seamless process through the use of ADS and CST's Microwave Studio.   Download

Module 5. Release for Manufacturing: Final Analysis and Fabrication
A final analysis of the entire RF board will be presented. This presentation will show how to generate an output file for a third party layout (i.e. Cadence Allegro) or directly to a RF board fabrication center. All the possible paths from ADS to other tools will be discussed.   Download

Seminar Downloads

eS